NOVOSENSE Microelectronics (NOVOSENSE, SSE Stock Code 688052) is a highly robust & reliable analog and mixed signal chip company. Since its establishment in 2013, the company has been focusing on sensor, signal chain, and power management, providing comprehensive semiconductor products and solutions, which are widely used in automotive, industrial, information communication and consumer electronics markets.
With the mission of "Sense & Drive the Future, Build a Green, Smart and Connected World with Semiconductors”, the company is committed to providing chip-level solutions to link the digital world and the real world.
Founded
Branch Offices
Employees
Company founded in 2013
Focus on the consumer electronics market
Break even
First 3-axis accelerometer SSC ASIC released
First Pressure sensor SSC ASIC released
Entering the automotive and industrial markets
Recognized again as a China national high-tech enterprise
Rated as an excellent enterprise in Jiangsu Province
First automotive IC released
First digital isolator released
Mass production of automotive-qualified pressure sensor IC
Obtained ISO 9001:2015 Quality Management System Certification from SGS
Recognized again as a China national high-tech enterprise
Mass production of temperature sensor IC
First MEMS pressure sensor released
ISO power and ISO interface released
Obtained TÜV ISO 26262 Functional Safety Management System ASIL-D certification
IPO on The Science and Technology Innovation Board
More than 100 million automotive chips shipped
ISO driver and ISO amplifier released
Mass production of Automotive ISO product family
First hall current sensor released & mass production
Automotive motor driver IC & Automotive power IC released
Expanding overseas markets, establishing branches in Germany, Japan, South Korea and U.S.
Recognized as a member of the AEC Technical Committee
Completes 100% equity acquisition of MagnTek in 2024
In the first half of 2025, NOVOSENSE's Automotive Business accounted for over 34.04% of the company revenue, with cumulative shipments of automotive chips exceeding 980 million pcs.
Automotive MCU+Driver, magnetic switch released
Automotive temperature and humidity sensors, CAN SIC, solid-state relays, low side and high side switches, LED drivers released
Real-time MCU/DSP, high-speed SerDes interfaces and ultrasonic radar ASSP
